国家/地区
IPC部 B（2）
IPC大类 B82（2） C09（2） H01（2）
IPC小类 B82B（2）
IPC B82B003/00（2）
发明人
公开年 2012（2）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Preparing a multilayer film comprising metal nanoparticles and a graphene-based material using electrophoretic deposition on a substrate, comprises electrophoretically depositing a layer of graphene-based material on the substrate.

CHEN X, NIU Z, BOEY Y C F, MA J