国家/地区 美国（2） 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（3）
IPC C08J007/04（3）
发明人 JANG B Z（2） JHONG Y（2） LEE S（2）
LIN Y（2） ZHAMU A（2）
公开年 2019（2）
申请年 2018（2） 
专利权人 NANOTEK INST.（2）

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Producing surface-metalized polymer film for e.g., diffusion barrier coating, by depositing graphene sheets and conductive filler to primary surface of film, moving graphene-coated film into metallization chamber, and collecting film.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S