国家/地区 中国（3）
IPC部 C（3）
IPC大类 C04（3）
IPC小类 C04B（3）
IPC
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparing hydroxyapatite bioceramic on titanium alloy surface by sol-gel method, comprises placing titanium alloy substrate on spin coater, dropping prepared sol containing phosphorus pentoxide on substrate surface, drying and heating.

ZHU J, HAN F, SHEN Q, ZHU Y, LUO H, GUO B, LIU Y

Zirconium hydride compound hydrogen resistance coating structure, has zirconium hydride substrate whose outer layer covered with layer of micro-arc oxidation coating, and outer layer of micro-arc oxidation coating coated with graphene layer.

YAN S, ZHANG P, CHEN W, YANG S