国家/地区 美国（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C014/34（2）
发明人
公开年
申请年 2016（2）
专利权人

High-conductivity electrical interconnect structure for electrically interconnecting electrical components, has metallic overlay portion that connects peripheral edges of graphene elements with each other.

TANIELIAN M H

Manufacturing method of graphene layer on substrate, involves exfoliating metalized graphene layer from first substrate and laminating metalized graphene layer to second substrate.

ZARETSKI A, LIPOMI D J