国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 LIU X（2）
公开年 2022（2）
申请年 2021（2）
专利权人

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparing composite plating layer useful in preparing electric contact material, comprises e.g. taking composite plating solution as plating solution, carrying out electric brush plating on surface of substrate to obtain composite plating layer and composite plating solution is silver nitrate.

MAO R, JIA L, YU J, HU J, HE C, YE Z, LIU X, CHEN W, TIAN X, PEI F