国家/地区 中国（2）
IPC部 B（2）
IPC大类 B23（2）
IPC小类 B23P（2） F28D（2）
IPC B23P015/26（2）
发明人
公开年
申请年 2020（2）
专利权人

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Graphene heat pipe has tube casing whose left end is provided with evaporation end cover and whose right end is provided with heat dissipation cover whose middle portion is provided with filling port.

CHEN W, WU X, DU H