国家/地区 中国（2） 美国（2）
IPC部 F（4）
IPC大类 H05（4）
IPC小类 B05D（2） C09D（2） E04F（2）
F24D（2） F28F（2） H05B（2）
H05K（2）
IPC B05D001/04（2） B05D003/06（2） C09D007/61（2）
C09D163/00（2） E04F015/08（2） F24D013/02（2）
F28F021/02（2） H05B003/10（2） H05B003/12（2）
H05K001/02（2）
发明人 PENG H（4）
公开年 2020（2）
申请年 2017（2）  2019（2） 
专利权人 GUANGDONG YU.（2） NORTHROP GRU.（2）

Preparing heating tile comprises e.g. after the tiles are unpacked by a unpacker, washing and blow-drying, after mixing graphene or functionalized graphene with a water-based epoxy resin in stirred tank, and performing jet dispersion.

PENG H

Preparation of heating ceramic tile by mixing optionally functionalized graphene and polyimide resin, milling, purifying, spraying obtained heating coating on ceramic tile, curing, attaching conductive material, and coating protection layer.

PENG H

Method for manufacturing heat spreader for printed wiring board, involves depositing layer of metal on layer of molybdenum and joining first and second graphene sheets to each other by alloy bonding first and second metal layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M

Printed wiring board, has thermal code material that is inserted between lower and supper surfaces of wiring boards, and includes planar graphene sheets thermo-mechanically bonded by metal alloy layer formed from planar layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M