国家/地区 中国（3）
IPC部 F（3）
IPC大类 F24（3）
IPC小类 F24D（3）
IPC F24D013/02（2）
发明人 WU C（2）
公开年 2015（3）
申请年 2015（3） 
专利权人

Semiconductor heating device, has P-type semiconductor and N-type semiconductor respectively arranged between heat end part and cold end part, where P-type semiconductor and N-type semiconductor are made of graphene material.

TANG Y, YU H

Graphene guide heat floor, has floor main body connected with multi-layer plate body, where multi-layer plate body is formed with graphite heat-conducting layer and graphene solution is coated on floor main body.

WU C

Graphene guide heat floor, has floor main body provided with multi-layer plate body that is coated with graphite heat-conducting layer, and electric heating wire and water pipe that are formed with mounting slot.

WU C