国家/地区 中国（4）
IPC部 F（4）
IPC大类 F28（4）
IPC小类 F28D（4）
IPC F28D015/02（4）
发明人
公开年 2021（3）
申请年 2021（4）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Semi-modular energy-saving graphene floor heating, has connecting spring whose upper and lower ends are connected with sliding rod, where end parts of two groups of sliding rods are correspondingly provided with clamping hook clamped in substrate.

YANG Y

Temperature equalizing plate for mobile phone, has upper cover plate whose upper plane is provided with placing cavity, and base whose lower plane is provided with other placing cavity that is paved with film block and sealed by lower sealing plate.

WANG F, LIAN Y, WU J

Dual-phase-change solid-state hydrogen source reactor has heat pipe, reactor heat conduction pipe provided in hydrogen source reactor, heat storage heat conduction pipe and heat storage material arranged in heat storage tank, and liquid-gas phase change material arranged in closed pipeline.

WU Z, FU T