国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Porous titanium carbide MXene/reduced graphene oxide based wallboard comprises a bottom plate, porous titanium carbide MXene/reduced graphene oxide-based heating film and panel, the panel made of transparent material.

WU L, CAO D, MA Y, YE D, LI M, LI Z, ZENG C, LIU Q