国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3） C08K（3） C08L（3）
C08J（2） C09D（2） H05B（2）
IPC C08L063/00（3）
发明人
公开年
申请年 2020（3）
专利权人

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Graphene electric heating film comprises upper protective layer, graphene electric heating layer, insulation layer and lower protective layer, where graphene electric heating layer comprises base layer and graphene coating.

XU J