国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B007/12（2） B32B009/00（2） B32B009/04（2）
B32B037/12（2） H05K007/20（2）
发明人
公开年 2023（2）
申请年
专利权人

High-strength graphene heat-conducting gasket in thermal interface material field, has stacking direction of graphene heat-conducting layer is perpendicular to stacking direction of graphene film in any layer of graphene heat-conducting layer.

WANG H, FANG X, SUN A, YANG S, CAO Y

Manufacture of laminated graphene-based thermally conductive film used for electronic assembly, involves providing laminated film comprising graphene film layers separated by adhesive and comprising graphene sheets aligned with plane of graphene film.

LIU J, LAUBECK T