国家/地区 日本（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C08K003/04（2） C08K003/38（2）
发明人 ANDO A（2）
公开年
申请年 2021（2）
专利权人 TOYO INK SC .（2）

Conductive composition used for forming conductive film used for applications such as conductive wiring, antenna materials for radio frequency identification, electromagnetic wave shielding materials, and materials for sensors, comprises binder resin and boron-containing carbon material.

NAKASONE D, KAWAHARA J, ANDO A

Boron-containing carbon material used in resin composition used for forming conductive film, comprises elemental boron which is doped so as to replace part of elemental carbon in carbon skeleton, where carbon material has specific content of boron element.

ANDO A, MOROISHI Y, MIYAFUSA Y, WATANABE H