国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08G073/10（2） C08J005/18（2） C08K003/04（2）
C08L079/08（2）
发明人 JIN L（2） ZHOU H（2）
公开年
申请年
专利权人 UNIV HARBIN SCI TECHNOLOGY（3）

Preparing toughening high heat-conducting filler based on thermosetting resin for improving toughness and heat conductivity of thermosetting resin, involves firstly dispersing functionalized carbon material in solvent A, then dropping isocyanate into obtained functionalized carbon material solution.

LIU K, ZHU X, WENG L, YU Y, XU H, ZHANG X

Preparing phenyl silsesquioxane/graphene oxide/polyimide three-phase composite film comprises e.g. dissolving expanded graphite with mixed acid solution, adding potassium permanganate, centrifuging, grinding and ultrasonically vibrating.

ZHOU H, WANG X, ZHANG H, JIN L

Producing silica hollow sphere/graphene oxide/polyimide composite film for printed circuit board, involves carrying out template method to obtain core-shell structure of microspheres, and sintering to obtain nano-silica hollow spheres.

JIN L, YANG Y, ZHOU H