国家/地区 中国（5） 韩国（4） 美国（4） 欧洲专利局（EPO）（3） 日本（2）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6） C08J（4） B65D（3）
C08K（3） C08L（3）
IPC B32B015/09（6）
发明人 HEO C（2） HEO C H（2） HEO J H（2）
KANG T（2） KANG T W（2） KANGTAEWOON（2）
PARK Y（2） PARK Y S（2） SOON P Y（2）
公开年 2021（3） 2022（2）
申请年 2020（2）  2021（2）  2022（2） 
专利权人 HANKOOK ALUM.（2） KOREA ALUMIN.（2）

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing medical packaging film with high barrier property comprises e.g. adding acetic anhydride and modified titanium dioxide-graphene oxide composite, preparing modified titanium dioxide-carboxymethyl cellulose composite, and preparing polyhydroxyl butyric acid valeric acid copolyester film.

ZHOU S, YUAN X, ZHANG C

Multi-layered packaging film for packaging article e.g., food package comprises outer print layer comprising polymer and/or paper, graphic element, and optional first nucleating agent, inner product-side layer, and lamination layer.

CHAM P M, NARAYANSARATHY S, RODGERS B D, JOHNSON A, SAMANTA S, CHAMPAKMEONG, NARAYANSARAHSISRIDEVI, DWAYNE R B, ADAM J, SATYAVRATHA S

Flame-retardant and environmentally friendly plastic includes PC plastic base layer, first cubic boron nitride flame-retardant layer arranged on upper surface of PC plastic base layer.

LI Z, ZHOU B, SHEN T

Pharmaceutical packaging sheet useful in pharmaceutical packaging material, comprises base layer, adhesive layer formed on base layer, aluminum layer formed on adhesive layer, and resin layer, where all layer includes graphene.

HEO C H, PARK Y S, KANG T W, HEO J H, SOON P Y, KANGTAEWOON, HEO C, PARK Y, KANG T

Packaging film useful for packaging retort food and medicinal material comprises first adhesive layer formed on sealant layer, core layer formed on first adhesive layer, second adhesive layer formed on core layer, and surface layer.

HEO J H, SOON P Y, KANGTAEWOON, HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T