国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） C08L（5） C08J（3）
IPC C08K003/04（5）
发明人 WANG X（5）
公开年 2015（5）
申请年 2014（5）
专利权人 WANG X（5）

Preparing electric conduction composite material comprises soaking graphene micro-chip and ultra-high molecular weight polyethylene powder using ethyl alcohol, ultrasonically dispersing, filtering and vacuum drying, molding, and cooling.

WANG X

Graphene-containing packing material for food packaging, commercial products packing, handicraft article, and disposable tableware degradable product comprises waste rice stick, carrageenan, polypropylene resin, stearate, and graphene.

WANG X

Curable resin conductive material comprises epoxy resin, conductive graphene nanoparticles, polyisoprene rubber and butylated hydroxytoluene antioxidant.

WANG X

Filled masterbatch for curable composition, comprises nano graphene, attapulgite, silane-polycarbonate resin copolymer, magnesium stearate, antimony trioxide, and antioxidant.

WANG X

High-density polyethylene pipe material comprises high-density polyethylene, electric conduction nano graphene, polyvinyl chloride, decabromodiphenyl oxide, antimony trioxide, acetophenone and 2,6-di-tert-butyl-4-methylphenol.

WANG X