国家/地区 美国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/11（2）
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Preparing polymer-sand nanocomposite comprises applying surface polymerization to surface of sand particles by combining polymerization initiator dissolved in solvent with the sand particles to form precursor sand mixture.

BATAWEEL M A, ALSHARAEH E, ALMOHSIN A

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J