国家/地区 美国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/11（2）
发明人
公开年 2022（2）
申请年
专利权人

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Forming barrier that is used for eliminating or reducing unwanted production of water in subterranean formation, involves injecting polymer-sand nanocomposite into one or more water producing fractures in subterranean formation.

BATAWEEL M A, ALSHARAEH E, ALMOHSIN A