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中国(2)
IPC部
B(3)
IPC大类
B32(3)
IPC小类
B32B(3)
IPC
C08K003/36(3)
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2014(3)
申请年
2013(2)
专利权人
Silicone rubber for anti-seismic laminates, contains methyl vinyl silicone rubber, dihydroxy polydimethylsiloxane, white carbon black, tung oil, nano-boron fiber, epoxy curing agent, fiberglass, emulsifier, graphene and carbon fiber.
ZHANG Q
Preparing flexographic printing plate precursor involves mixing e.g. graphene, inorganic filler to ethylene-propylene-diene terpolymer rubber, compounding and calendering mixture, and grinding continuous infrared radiation ablatable layer.
MELAMED O, GAL I, DAHAN L
Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.
CHAI S, SU X
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