国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08J（2）
IPC C08K003/38（2）
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Heat conducting interface material useful in electronic product and/or automobile field comprises heat-conducting film layer compounded on first resin layer and second resin layer compounded on heat-conducting film layer.

WANG Y

Biodegradable oriented complex film with high gas barrier properties useful in agricultural, electronic, electric appliance, building, food, medical and so on coating and packaging comprises coating layer and base layer.

WANG W, LIU P, LI J, LAI L