国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（3） C08F（2）
IPC C08K003/04（3）
发明人 ZENG G（3） LI Z（2）
公开年 2018（3）
申请年 2017（3）
专利权人 UNIV HUNAN TECHNOLOGY（3）

Preparing electronic element plastic board comprises e.g. dispersing graphene oxide, maleic anhydride, poly-4-methyl-1-pentene and initiator, melt-blending, adding metal compound flame retardant, silane coupling agent and melt-blending.

ZENG G, ZHANG Y, LI Z

Preparation of plastic involves mixing graphene, maleic anhydride, high-density polypropylene and initiator, ultrasonically dispersing material and then placing in twin screw extruder, mixing silane coupling agent and dispersant and drying.

ZENG G, LI Z, CHEN Y

Preparation of plastic involves weighing graphene oxide, dispersant, maleic anhydride, high-density polypropylene and initiator and then melting, adding dispersant, anhydrous ethanol, lubricant and antioxidant and leaving and melting.

ZENG G, LIU W, LIU S