国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08J（2）
IPC C08J007/04（2）
发明人 ZHAO T（2）
公开年
申请年
专利权人

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X