国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年 2022（2）
专利权人

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing polyimide composite material with double thermally conductive network comprises e.g. mixing polyamic acid powder, water, triethylamine and first thermally conductive filler, freeze-drying, performing thermal imidization, vacuum-impregnating and hot-pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D