国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2） F21V（2）
IPC F21V029/85（2）
发明人
公开年 2021（2）
申请年
专利权人 AMOGREENTECH CO LTD（2）

Light emitting diode headlamp module for automobiles, consists of metal plate for supporting lamp, and heat dissipation case formed of heat-resistant plastic, and comprising region accommodating metal plate, and region having protrusion.

LEE H K

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z