国家/地区 韩国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（2） C09D007/61（2） F21Y115/10（2）
发明人
公开年 2022（3）
申请年 2021（2） 
专利权人

Heat-dissipating coating composition useful for producing LED lighting luminaire, comprises carbon nanotubes, epoxy resin, dispersibility improving copolymer, photoinitiator, and thermally conductive material.

PARK J, KWON Y K

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D