国家/地区 美国（3）
IPC部 C（3） B（2） H（2）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC B82B003/00（2） B82Y030/00（2） C08K003/04（2）
发明人
公开年 2012（3）
申请年 2012（3）
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Making graphene nanoribbon comprises contacting poly(phenylene ethynylene) polymer, annulating compound, and catalyst system comprising metal catalyst and protic acid, and oxidizing the arylannulated polymer product.

DICHTEL W R, ARSLAN H, URIBEROMO F J

Resin composite material is obtained by chemically bonding reactive polyfunctional compound to both of thermoplastic resin, and carbon material having graphene structure.

MUKOHATA D, INUI N, TAKAHASHI K, OSANO K, MUKAIHATA D