国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/04（2）
发明人 LI Q（2）
公开年
申请年
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Preparing differential epigenetic involves mixing an oxalic acid solution, hypochlorous acid solution, bismuth vanadate, graphene oxide, zinc oxide, rutile titanium oxide, and hydrotalcite for hydrothermal reaction, and grinding.

FAN Y, LING R, LI Q, TAO R, ZHANG F, HU C