国家/地区 中国（2）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08K003/36（3）
发明人
公开年 2022（3）
申请年
专利权人

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Preparing graphene and natural silk reinforced epoxy composite materials by providing mixed solution for graphene oxide solution, epoxy resin and relevant hardener, producing homogeneous graphene oxide/epoxy resin, impregnating with silk fabric to reach final product, and synthesizing final product.

SHARMA S, SANJEEV K, SHARMA P B, ISMAIL A H

Composite material useful for fiber winding, comprises bisphenol A type epoxy resin, toughening epoxy resin, wetting agent, active diluent, hydrophobic modified nano filler, coupling agent, antifoaming agent, latent curing agent, accelerator and wetting dispersant.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W