国家/地区
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年
专利权人

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Polyimide composition comprises polyimide, where polyimide is polymeric reaction product of dianhydride and one or more diamines, where diamines comprises fluorine-containing alkyl ether diamine, and thermally conductive fillers.

CONNELL J W, BELCHER M A, GHOSE S