国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC
发明人
公开年 2015（2）
申请年 2014（2）
专利权人

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Forming polyaniline/reduced graphene oxide composite involves dispersing graphene oxide in aqueous solution of anionic emulsifying agent to form dispersion, dissolving aniline oligomer in solvent and mixing oligomer solution with dispersion.

BOCCHINI S, CHIOLERIO A, PORRO S