国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08G073/06（3）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing glue composition involves adding graphene powder and polymer monomer, where mixture is added with solvent.

CHEN Y, LI Y, ZHANG X, LEE Y

Graphene dispersion used for manufacturing graphene-ionic liquid polymer composite, comprises graphite dispersed in ionic liquid.

SUH K S, KIM J E, KIM T Y, KIM J, KIM T