国家/地区 德国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（2） C08L（2）
IPC
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Treating molded component used for product, involves bringing molded component into contact with workpiece by introducing area of workpiece into molded component, extending out of surface of molded component and contacting molded component with solvent.

FOLGER A, ROSENFELD A

Thermosetting mass as adhesive to join substrates, comprises radically curable compound containing (meth)acrylate, radical initiator based on peroxo compound containing peroxodicarbonate, stabilizer comprising sterically hindered phenol.

BRIEM M, MAIER K, MAIER C

Solid polymer conductive composite used for non-metallic aircraft fuel delivery system component, is prepared from composition comprising polyaryletherketone polymer, conductive filler, and dispersing and processing additive.

MAPKAR J A, SALUNKE N, DEMUTH M J