国家/地区 法国（4）
IPC部 B（4） C（4） H（2）
IPC大类 B29（4）
IPC小类 B29C（4）
IPC B33Y010/00（2） C08J005/00（2）
发明人
公开年
申请年
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Thermosetting composite material used for three dimensional printing by extrusion, comprises a furan polymer forming a thermosetting matrix of the composite material and a a material immiscible with the thermoset matrix cissable.

BENEVENTI D, CHAUSSY D, BOUZIDI K, GANDINI A

Freeze-dried composition useful as ink of three-dimensional (3D) printer for producing 3D element or 3D figure comprises metal powder comprising gold, silver, platinum and rhodium, graphene, silica, resin, and biological sample of subject.

PRIETO G, LOPEZVALERA F R, SAIZ A, NARBON P G, SANCHEZGUITARD L, TERUEL S A, NARBON PRIETO G, SANCHEZGUITARD LOPEZVALERA, TERUEL SAIZ A, SANCHEZGUITARD L F

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A