国家/地区 台湾（2）
IPC部 C（2） H（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人 IND TECHNOLOGY RES INST（2）

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G