国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） B32B（3）
C08J（3） B29C（2） C09D（2）
IPC C08K007/06（4）
发明人
公开年 2021（2）
申请年
专利权人

High thermal conductivity reinforced polyphenylene sulfide composite material comprises polyphenylene sulfide substrate, surface carbonization reinforcement and thermally conductive filler.

ZHOU G, YIN H, CHEN Z, HAN Y, SHEN J, DENG H, ZHOU Y

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Plastic composition useful for forming product in connection structure, and coated body, comprises a polyamide resin and a graphene oxide.

SHIOZAKI R

Carbon fiber product used as material for, e.g. composite, comprises coaxial stacking morphology of truncated conical tubular graphene layers including stacked hexagonal carbon layers.

YANAGISAWA T, ENDO M, YANAGISAWA G C C