国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C22（2）
IPC小类 C22C（2）
IPC
发明人 LEE J（2）
公开年 2023（2）
申请年 2022（2） 
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

High-strength steel plate comprises base steel plate, and ferrite layer having internal oxide layer on which iron-nickel alloy layer is formed with excellent surface quality formed in internal oxide layer from surface of ferrite layer.

LEE K, LEE C, KANG K, KIM N, JANG Y, LEE J, KANG K C, KIMNAMAH, JANG Y M