国家/地区
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C016/26（2）
发明人
公开年 2022（2）
申请年
专利权人

Acetylene fluid supply package for use in fabricating a semiconductor device, has pressure vessel, porous filler in the pressure vessel, improved solvent within the porous filler, where solvent solubilizing with acetylene absorbed within the improved solvent, improved solvent is triethyl phosphate.

HAN Y, CHUNG W, CHO Y, KANE W S, SONG X, SINHA A K, CHO Y J

Preparation method of nano liquid absorbing core for intelligent product or electronic product, involves taking metal core and in situ growing graphene with hydrophilic functional groups on surface of the metal core.

JIA Y, WU Q, MA Y