国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D005/56（2）
发明人
公开年
申请年 2019（2）
专利权人

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z

Plastic plating comprises coating the surface of plastic substrate with graphene-based conductive ink, curing graphene-based conductive ink to form graphene-based conductive ink layer, electroplating after depositing and drying.

ZHENG N, MAO H, WU B, CAO F