国家/地区 中国（5） 美国（5） 韩国（3） 欧洲专利局（EPO）（2） 日本（2） 台湾（2）
IPC部 B（7）
IPC大类 C09（7）
IPC小类 C09D（7） H01L（4） B05D（3）
B32B（3） B01J（2） C09K（2）
IPC C09D005/00（7）
发明人
公开年 2023（2）
申请年
专利权人

Heterogeneous coated steel sheet useful for display device comprises grater, heat insulating coating layer formed on first region and heat dissipation coating layer formed on second region of first surface of steel sheet.

KIM J K, CHO J D

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Secondary battery pouch film comprises sealant layer, adhesive layer formed on sealant layer, primer layer formed on adhesive layer, core layer formed on primer layer and surface layer, where at least one above-mentioned layer has graphene.

HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T, HEO J H, SOON P Y, KANGTAEWOON

Composition used in protective coating of steel structure, comprises performance modifier and modified filler comprising heavy calcium carbonate, fine ceramics, beryllium oxide, boron nitride, chromium oxide, carbon fiber ash and graphene.

PARK D S

Transparent antistatic film useful in electronic devices, comprise substrate comprising first surface, and transparent graphene coating disposed on the first surface and comprising surface modified graphene nanosheets and carrier resin.

WU M Y, HSIEH C, SHEN F, CHEN T, JIAN Y, WU Y, XIE C, CHEN Z

Heat conducting composite material, useful in thermal garment, solar microwave water purifier, infrared paint or LED, comprises a matrix, and many graphene sheets respectively having two-dimensional planar structure.

LIN H, LIN I, LIN Y, SONG J, SUNG C, SUNG C M, LIN I C

Multilayer structure, used in e.g. solar cell, flexible display and sensor, comprises a covalent organic framework layer in contact with a polycyclic aromatic carbon layer (e.g. graphene) which is in contact with a substrate (e.g. copper).

DICHTEL W R, PARK J, MUKHERJEE A, LEVENDORF M P, WOLL A, SPITLER E, COLSON J, SPITLER E L, WOEHL A, PARKER J