国家/地区 中国（3）
IPC部 B（3）
IPC大类 B21（3）
IPC小类 B21B（3）
IPC C23C028/00（3）
发明人
公开年 2022（2）
申请年 2022（2） 
专利权人

Coated aluminum-silicon plated steel plate useful in thermoformed component, comprises steel substrate and aluminum-silicon coating coated on the surface of the steel substrate, where the surface of the aluminum-silicon coating is covered with coating.

MA X, JIN X, LIU H, TAN N

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparation method of metal magnesium-copper-graphene layered composite material, involves annealing accumulated and rolled plate to obtain laminated magnesium-based composite plate reinforced by graphene and copper.

PAN F, WANG Y, LUO H, TANG B, LI J, CHEN X