国家/地区 中国（2）
IPC部 B（2）
IPC大类 B21（2）
IPC小类 B21B（2）
IPC B21B003/00（2）
发明人 LI C（2）
公开年
申请年
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparation of graphene-reinforced copper-based composite material for use as high-conductive material, involves taking pure copper sheet, and removing oil stain on surface of oxide film, dispersing graphene in ethanol, and vibrating.

MEI Q, CHEN F, GUO Y, LI C, MA Y, LI J