国家/地区 中国（3）
IPC部 B（3） C（3） H（2）
IPC大类 B22（3） C22（3） H01（2）
IPC小类 B22D（3）
IPC C22C001/10（3）
发明人
公开年 2022（3）
申请年 2021（3）
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Superconducting copper comprises oxygen-free copper, graphene, lead, niobium, and titanium.

MU Y, HU W

Formation of U-shaped support for automobile, involves adding refining agent to alloy melt, injecting inert gas for refining, removing slag and filtering, pouring alloy melt into mold, performing vacuum die-casting, and demolding, and performing normalizing, tempering and annealing on blank.

JIN C, JIN R, LAI Z, JIN L, LIU D, JIN F, JIN Y