国家/地区
IPC部 B（2）
IPC大类 B22（2） C22（2） H01（2）
IPC小类 B22D（2）
IPC C22C009/00（2）
发明人
公开年
申请年
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Treating method of material, involves drying mixture to dry powder, thus forming treated material after mixing solution which excludes silver, iron, pyrite, and graphene into additional mixture if brass and copper granules.

BOURQUE J M