国家/地区 中国（3）
IPC部 B（3）
IPC大类 B22（3） C22（3） H01（3）
IPC小类 B22D（3）
IPC C22C001/10（3）
发明人
公开年 2022（3）
申请年 2021（2） 
专利权人

Preparation method of graphene copper composite material used in e.g. modern electronic information industry field, involves continuously casting mixture of copper powder and graphene in vacuum condition.

WANG E, WANG Y, HU X, ZHANG R, WANG X, LIU K, FU Y

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Superconducting copper comprises oxygen-free copper, graphene, lead, niobium, and titanium.

MU Y, HU W