国家/地区 中国（2）
IPC部 B（2）
IPC大类 B29（2） B32（2） C08（2）
IPC小类 B29C（2）
IPC C08J005/04（2）
发明人
公开年 2017（2）
申请年 2017（2）
专利权人

Plastic composition useful for forming product in connection structure, and coated body, comprises a polyamide resin and a graphene oxide.

SHIOZAKI R

Prepreg used in laminate for printed circuit board comprises reinforcing material, and thermosetting resin composition including thermosetting resin and inorganic filler that is coated with graphene oxide and molybdenum disulfide nanosheet.

GUO C