国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC C08K003/36（2）
发明人
公开年
申请年 2020（2）
专利权人

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M