国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B033/00（3）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Heat-conducting packaging film useful for preparing solar battery assembly comprises upper surface layer and/or lower surface layer attached to surface of main heat-conducting layer.

YAN S, WANG L, ZHENG Y, HAN X, CHEN H, WU X

Mobile terminal back board used in mobile terminal, comprises heat conductive layer containing graphene or graphene oxide, and thermoplastic resin, strength layer, where strength layer is disposed on one surface of heat conductive layer.

ZHANG J, LI J