国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B037/06（2）
发明人
公开年 2022（2）
申请年 2021（2）
专利权人

Composite structure heat conducting plate for use in electronic chip industry, has m metal layers and n graphite layers, where m metal layers and n graphite layers are alternately arranged and assembled by vacuum diffusion bonding process.

HU T, NIU T, GUO S, CHEN X

Composite material used for improving electroconductivity of metal, has graphene fragment layer that comprises graphene fragments uniformly spread on metal foil layer.

GONG M, SUN B, WANG Y, CHEN Q, YANG W, LI Y, LIANG J, LIU B, ZHANG X, PEI Z