国家/地区 台湾（2）
IPC部 C（2）
IPC大类 C01（2） H01（2）
IPC小类 C01B（2）
IPC C01B032/25（2）
发明人
公开年
申请年
专利权人

Semiconductor device e.g. monolithic three-dimensional integrated circuit, has microelectronic components embedded in single crystalline dielectric material, where material contains carbon with diamond structure or hexagonal boron nitride.

CLARK R D, CLARK R

High thermal conductive hybrid film comprises reduced graphene oxides, and nano hybrid structures mixed with reduced graphene oxides and both comprising a nanodiamond and a carbon layer coating the nanodiamond.

TAI N, YUAN H, TAI N H, YUAN H C