国家/地区 中国（4） 台湾（2） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B032/182（6）
发明人 LI L（2）
公开年 2021（4）
申请年 2020（4） 
专利权人 SHANXI SHENG.（2）

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Cooling device for processing graphene, has exhaust fan whose input end is fixedly connected with Y-shaped pipe, where two output ends of Y-shaped pipe are connected with back of heat collecting box and front of box body is connected with control switch.

LI C

Cooling device for processing graphene, has second cooling pipe whose one end is fixedly connected with storage box and other end is connected with one end of first cooling pipe through conduit.

LI L

Cooling device for graphene processing, comprises bottom plate, where top of bottom plate is fixed with supporting plate, one end of supporting plate is fixed with box body and bottom end of box body is fixed with L-shaped frame.

LI L

Heat transfer enhancement device, has substrate provided with heating surface, and graphene layer uniformly coated on heating surface and provided with graphene surface and working fluid, where working fluid is exchanged with surface of graphene.

YANG C, SU C, HUANG C, JHANG B

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J